Global Unichip : GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP applying TSMC Sophisticated Packaging Engineering

Apr. 06, 2023

Hsinchu, Taiwan-April 6, 2023 – World-wide Unichip Corp. (GUC), the Sophisticated ASIC Leader, announced currently that it has productively taped out a exam chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking applications. GLink 2.3LL die-to-die interface presents greatest-in-course Power, Effectiveness, and Location (PPA) with 5ns conclude-to-end latency, 5Tbps/mm seashore-front (2.5T full-duplex) and .27pJ/bit electrical power effectiveness. The test chip’s taped out at the TSMC 3nm system and adopts the TSMC CoWoS®superior packaging technological innovation.

GUC’s HBM3 Controller and PHY IPs are out there at TSMC’s 7nm and 5nm system nodes supporting both CoWoS-S and CoWoS-R systems. The IPs had been validated with both of those SK hynix and Samsung HBM3 recollectionsGUC’s HBM3 Controller demonstrated increased than 90% bandwidth utilization at random entry.

GLink 2.3LL supports TSMC’s Info_oS and CoWoS-S/R systems. It experienced previously been silicon validated at TSMC’s 5nm approach node. GUC presents entire AXI, CXS, and CHI bus bridges with configurable parameters using the GLink 2.3LL actual physical interface. The GLink 2.3LL I/Os’ large cross-speak tolerance allows CoWoS/Data unshielded routing, successfully doubling the amount of sign traces of the interposer or RDL.

Equally HBM and GLink have integrated proteanTecs’ interconnect monitoring option to offer high visibility for screening and characterizing the PHY, and to enhance the stop-item with in-field overall performance and trustworthiness observability. With this tape out at 3nm, the GLink/HBM IP portfolio is now accessible in TSMC’s 7nm, 5nm and 3nm systems, which have been adopted by AI/HPC/Networking customers in their merchandise.

“We are proud to be the world’s to start with enterprise to tape out an 8.6Gbps HBM3 controller and PHY IP as very well as the most successful die-to-die interface GLink 2.3LL at 3nm engineering,” reported Dr. Sean Tai, president of GUC. “We have now established a complete 2.5D/3D chiplet IP portfolio for superior technology up to 3nm. Alongside one another with style and design knowledge, package style, electrical and thermal simulations, DFT and production screening on TSMC 3DFabric™, a in depth loved ones of 3D silicon stacking and state-of-the-art packaging systems which includes TSMC-SoIC®, CoWoS, and Info, we give cutting edge options to our customers and support them to achieve even larger good results in their products and enterprises.”

“We keep providing best-in-course die-to-die interfaces enabling a chiplet revolution. Our IPs span by way of all TSMC’s sophisticated course of action and 3DFabric technologies. Convergence of 2.5D and 3D packaging making use of HBM3, GLink-2.5D/UCIe and GLink-3D interfaces permits remarkably modular, chiplet-based mostly, much more substantial than reticle sizing processors of the long run,” stated Igor Elkanovich, CTO of GUC.

GUC HBM and GLink-2.5D IP Highlights

To master additional about GUC’s HBM3/2E, GLink-2.5D/3D IP portfolio, and Data/CoWoS/3DIC overall solution, you should speak to your GUC revenue consultant directly or e mail [email protected]

About GUC

Global UNICHIP CORP. (GUC) is the Highly developed ASIC Leader who gives the semiconductor market with leading IC implementation and SoC producing companies, working with sophisticated course of action and packaging technologies. Primarily based in Hsin-Chu, Taiwan, GUC has made a world-wide status with a presence in China, Europe, Japan, Korea, and North The us. GUC is publicly traded on the Taiwan Inventory Exchange less than the symbol 3443.